Title:
削孔装置
Document Type and Number:
Japanese Patent JP5800587
Kind Code:
B2
Inventors:
Shigeru Sezaki
Application Number:
JP2011133839A
Publication Date:
October 28, 2015
Filing Date:
June 16, 2011
Export Citation:
Assignee:
Incline Slope Research Institute
International Classes:
E21B10/61; E21B3/00
Domestic Patent References:
JP7324580A | ||||
JP57044095A | ||||
JP5054696U | ||||
JP53009205A | ||||
JP59069285U |
Attorney, Agent or Firm:
Makoto Kono