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Title:
削孔装置
Document Type and Number:
Japanese Patent JP5800587
Kind Code:
B2
Inventors:
Shigeru Sezaki
Application Number:
JP2011133839A
Publication Date:
October 28, 2015
Filing Date:
June 16, 2011
Export Citation:
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Assignee:
Incline Slope Research Institute
International Classes:
E21B10/61; E21B3/00
Domestic Patent References:
JP7324580A
JP57044095A
JP5054696U
JP53009205A
JP59069285U
Attorney, Agent or Firm:
Makoto Kono



 
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