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Patent Searching and Data


Title:
DRY ETCHING METHOD
Document Type and Number:
Japanese Patent JPS5827983
Kind Code:
A
Abstract:

PURPOSE: To etch a material to be etched uniformly without decreasing the speed of etching by making the stroke in scanning magnets larger in the size than the diameter of said material and accelerating the moving speed of the magnets during moving in the areas off the area right under the material to be etched.

CONSTITUTION: In the stage of etching a material 6 to be etched with a dry etching device, the strokes in the scanning of permanent magnets 1a, b, c which are means for generating magnetic fields are set larger than the diameter of the material 6. The scanning speeds during the movement of the magnetic fields generated by the magnets 1a, b, c in the area larger than the diameter of the material 6 are made faster than the speeds during moving over the material 6. In other words, the scanning speed in the areas other than the area above the diameter of the material 6 wasteful for the etching are accelerated, whereby the loss of time is reduced and the material is etched uniformly in the etching area.


Inventors:
OKANO HARUO
YAMAZAKI TAKASHI
HORIIKE YASUHIRO
Application Number:
JP12524781A
Publication Date:
February 18, 1983
Filing Date:
August 12, 1981
Export Citation:
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Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
C23F4/00; H01J37/32; H01L21/302; H01L21/3065; (IPC1-7): C23F1/00; H01L21/302
Attorney, Agent or Firm:
Noriyuki Noriyuki