Title:
DRY ETCHING METHOD
Document Type and Number:
Japanese Patent JPS61156739
Kind Code:
A
Abstract:
PURPOSE:To form a suitable round shape which is formed by etching and to reduce the effect of over exposure when an exposing process is performed without generation of the disconnection at a stepped part by a method wherein a plurality of dry etching conditions are combindly used. CONSTITUTION:A part 22 is formed by performing an isotropic etching which is the first stage etching, and an overhang which is hardly exposed to plasma directly is formed below a mask 21, and a round shape 23 is obtained by performing the second stage etching. Under the above-mentioned condition, a polymer is formed easily on the region which comes in contact with the plasma directly, but the polymer is not formed on the part shaded by the mask 21, and the etching progresses suddenly in lateral direction. A cross-sectional form after etching having an isotropy or a slight taper is obtained by performing the etching of the third stage. As the above-mentioned condition is set in such a manner that a polymer can be formed in almost all regions, and also an istropy is accomplished by the directivity of ions, almost no side etching is generated. Accordingly, a microscopic work can be performed in an excellent reproducible manner.
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Inventors:
KUDO HITOSHI
Application Number:
JP28017284A
Publication Date:
July 16, 1986
Filing Date:
December 27, 1984
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Toshio Nakao