Title:
ダミー基板
Document Type and Number:
Japanese Patent JP4435610
Kind Code:
B2
Abstract:
A dummy substrate is obtained by covering a silicon substrate with a resin coating. This increases the strength of the dummy substrate, prevents pieces and particles of the silicon substrate from scattering, and even when the dummy substrate is damaged during processing, prevents them from contaminating a processing apparatus. The use of a chemical-resistant resin for the resin coating restrains the dummy substrate from being etched by a cleaning process using a chemical solution and increases the number of times that the dummy substrate can repeatedly be used.
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Inventors:
Kenichi Ishihara
Application Number:
JP2004084430A
Publication Date:
March 24, 2010
Filing Date:
March 23, 2004
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/304; F26B19/00; F26B25/06; H01L21/00; H01L21/02; H01L21/306
Domestic Patent References:
| JP2002175959A | ||||
| JP2000260671A | ||||
| JP2003133194A | ||||
| JP8250458A | ||||
| JP1032184A | ||||
| JP2001217218A | ||||
| JP200233291A | ||||
| JP200252358A | ||||
| JP2000272910A |
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura