Title:
DUMMY LOAD FOR HIGH POWER HIGH FREQUENCY SIGNAL
Document Type and Number:
Japanese Patent JPH09162606
Kind Code:
A
Abstract:
To enable the use of a load under a high vacuum environment because of the use for a high power high frequency signal without causing a leakage of cooling water to a waveguide due to a damaged ceramic or deterioration in a soldered part.
In the dummy load fitted to an end of a rectangular metal-made waveguide 21 as a high frequency power absorbing body, SiC tiles 23 are brazed to an inner face of the rectangular metal-made waveguide 21 in parallel with its electric field and a cooling duct 25 is formed on an outer face of the waveguide 21 to dissipate a heat generated from the SiC tiles 23 by means of water or wind cooling.
Inventors:
MIURA TAKASHI
SATO KIYOKAZU
TAKEDA OSAMU
NABA TAKAYUKI
SATO KIYOKAZU
TAKEDA OSAMU
NABA TAKAYUKI
Application Number:
JP31649695A
Publication Date:
June 20, 1997
Filing Date:
December 05, 1995
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01P1/26; H01P1/30; H01P5/02; (IPC1-7): H01P1/26; H01P1/30; H01P5/02
Attorney, Agent or Firm:
Takehiko Suzue
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