Title:
半導体装置の除塵用基板
Document Type and Number:
Japanese Patent JP4307271
Kind Code:
B2
Inventors:
Hirofumi Fujii
Daisuke Usanda
Yoshio Terada
Funami Asami
Ryo Namikawa
Daisuke Usanda
Yoshio Terada
Funami Asami
Ryo Namikawa
Application Number:
JP2004004512A
Publication Date:
August 05, 2009
Filing Date:
January 09, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09D5/16; H01L21/304; C08G73/14; C09D179/08; C09D201/00; H01L21/02
Domestic Patent References:
JP2003115521A | ||||
JP2003129025A | ||||
JP2003287750A | ||||
JP2002076211A | ||||
JP2002158199A |
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Hironori Honda
Toshimitsu Ichikawa
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