Title:
縁部分解能強化渦電流センサ
Document Type and Number:
Japanese Patent JP5615831
Kind Code:
B2
Abstract:
An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.
Inventors:
イラバニ， ハサン ジー．
カールソン， インゲマー
スウェデク， ボグスロー エー．
カールソン， インゲマー
スウェデク， ボグスロー エー．
Application Number:
JP2011536448A
Publication Date:
October 29, 2014
Filing Date:
November 11, 2009
Export Citation:
Assignee:
アプライド マテリアルズ インコーポレイテッドＡＰＰＬＩＥＤ ＭＡＴＥＲＩＡＬＳ，ＩＮＣＯＲＰＯＲＡＴＥＤ
International Classes:
H01L21/304; B24B49/10; G01B7/06; G01D5/20
Attorney, Agent or Firm:
Yoshitaka Sonoda
Yoshinori Kobayashi
Yoshinori Kobayashi