PURPOSE: To obtain a small-sized thin edge surface type thermal head by using a bendable flexible printed circuit board as the printed wiring board connected to a heat generating substrate.
CONSTITUTION: A flexible printed circuit board(FPC) 9 is loaded with a thermistor 10 on the side of a heat generating substrate 3 from a bending part 8 and also loaded with a connector 11 and a chip type ceramic capacitor 24 on the side opposite to the substrate 3 from the bending part 8 and can be made bendable at the bending part 8 at the time of use. A reinforcing plate 12 is bonded to the part loaded with a connector 11 of the FPC 9 to enhance the connection reliability of the connector 11. The thermistor 10 is arranged in contact with the substrate 3 and coated with the highly heat-conductive resin 23 fixed to the substrate 3 so as to well transmit the heat of the substrate 3. Since the chip type ceramic capacitor 24 is used, a thermal head is miniaturized and thinned still more as a whole as compared with a radial type aluminum electric condenser.
| JPS6341172 | PRINTING HEAD COOLING SYSTEM |
| JP2003291455 | IMAGING APPARATUS |
| JPS62277509 | METHOD AND DEVICE FOR EVALUATING PRINTING OR DRAWING PICTURE QUALITY |
KOAIZAWA NAGAHARU
UENO NOBORU
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