Title:
POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3224602
Kind Code:
B2
Abstract:
PURPOSE: To provide a positive photoresist compsn. capable of forming a resist pattern effective in producing a semiconductor device, a thin film transistor, etc., and excellent in adhesion to a silicon substrate or a substrate of a metal such as tantalum.
CONSTITUTION: At least one kind of adhesion improver selected among benzimidazoles represented by the formula (where R is H or 1-3C alkyl) and polybenzimidazole is incorporated into a basic compsn. consisting of alkali- soluble novolak resin and a compd. having a quinonediazido group to obtain the objective positive photoresist compsn.
Inventors:
Koichi Takahashi
Tetsuya Kato
Hidekatsu Kohara
Toshimasa Nakayama
Tetsuya Kato
Hidekatsu Kohara
Toshimasa Nakayama
Application Number:
JP20624192A
Publication Date:
November 05, 2001
Filing Date:
July 10, 1992
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/022; G03F7/085; G03F7/09; H01L21/027; (IPC1-7): G03F7/022; G03F7/085; G03F7/09; H01L21/027
Domestic Patent References:
| JP5636648A | ||||
| JP6227732A | ||||
| JP239049A | ||||
| JP2161444A | ||||
| JP6235350A |
Attorney, Agent or Firm:
Agata Akira (1 person outside)