PURPOSE: To obviate the necessity of installing a positioning device in vacuum by equipping this device with a means for removing an oxide film from the surface of solder, an in-process monitoring and control means, a positioning means, and a heating means for fusing solder in nonoxidative or reductive atmosphere.
CONSTITUTION: A sputter cleaning device 100 consists of three chamber composed of a preserve chamber 1, a cleaning chamber 2, and a takeout chamber 3, and each chamber is connected by a gate valve. For the solder zone of a member 14 for junctioning transfer in the sputter cleaning device 100, a connection pad, and others, oxide films, films polluted by organic matters, etc., are removed from the surfaces by the irradiation with ions/atoms. Next, the material 14 for junction is transfered by a positioning mechanism 300 and is positioned, and is transfer into a belt furnace 200, and the junction part is heated and fused. The belt furnace 200 consists of three chambers of a preliminary chamber 10, a heating fusing chamber 11, and a cooling chamber 12, and each chamber is connected by a gate valve.
IJUIN MASAHITO
SATO RYOHEI
SHIRAI MITSUGI
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