PURPOSE: To realize high-density multi-point connection and to improve several characteristics of heat or the like, by alloying connection parts of a first electric circuit component and connecting with metallic member's ends which are exposed to the side of the first electric circuit component and next alloying connection parts of a second electric circuit component and connecting with metallic member's ends which are exposed to the side of the second electric circuit component.
CONSTITUTION: An electrical connection member 125 is obtained by allowing a plurality of metallic members 107 to be formed of metals or alloys and insulating these metallic members 107 from each other. The electrical connection member 125 is further formed by allowing the metallic member 107's one-sided ends to be exposed to the side of a first circuit substrate 101 and allowing the metallic member 107's other-sided ends to be exposed to the side of a second circuit substrate 104 and besides allowing the metallic members 107 to buried into a holder 122 made of a metal or an alloy via an insulating material 140. A connection part 102 of the circuit substrate 101 is connected with the metallic member 107's one-sided ends exposed to the side of the circuit substrate 101 by an alloying method. Further, a connection part 105 of the circuit substrate 104 is connected with the metallic member 107's one-sided ends exposed to the side of the circuit substrate 104 by an alloying method. Accordingly, the number of connection parts can be increased and high integration can be realized.
| JPH08288319 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
| JP2003096426 | ADHESIVE MEMBER |
| JPS60202955 | SEMICONDUCTOR DEVICE |
NISHIDA HIDEYUKI
IMAIZUMI MASAAKI
ICHIDA YASUTERU
KONISHI MASAKI
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