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Title:
ELECTRIC CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH02158200
Kind Code:
A
Abstract:

PURPOSE: To improve surface appearance, and to obtain excellent electromagnetic-wave trouble preventive characteristics by containing a specific quantity of a methyl methacrylate-butadiene-styrene copolymer resin in a styrene group resin.

CONSTITUTION: A 5-50wt.% MBS resin (a methyl methacrylate-butadiene-styrene copolymer resin) is included in all styrene group resin comprising the MBS resin in addition to the styrene group resin. That is, when the MBS resin is compounded into such a styrene group resin composition at a fixed rate, a phenomenon in which styrene fibers are exposed to the surface of a molded form, and the appearance of the molded form is improved remarkably. The loading of the MBS resin in all styrene group resin must be kept within a range of 5-50wt.%, and it is desirable that the loading is kept within a range of 10-30wt.% particularly. The effect of the improvement of appearance is not displayed sufficiently when the loading of the MBS resin is made smaller than 5wt.%, and the viscosity of the resin composition is increased and moldability is inhibited when the loading exceeds 50wt.%. The molded form using such a conductive resin composition is employed, thus acquiring an electromagnetic shielding housing having excellent appearance.


Inventors:
YOSHIMURA YASUO
TAKENAKA HIDEO
TAKEDA KAZUYA
Application Number:
JP31322188A
Publication Date:
June 18, 1990
Filing Date:
December 12, 1988
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO
International Classes:
H05K9/00; (IPC1-7): H05K9/00
Domestic Patent References:
JPS58184799A1983-10-28
Attorney, Agent or Firm:
Katsuo Naruse (3 outside)