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Title:
ELECTRIC CURRENT BONDING APPARATUS AND ELECTRIC CURRENT BONDING METHOD
Document Type and Number:
Japanese Patent JP2007260690
Kind Code:
A
Abstract:

To provide an electric current bonding apparatus which can perform a uniform bonding by controlling the temperature difference caused in the joining surfaces between metallic members regardless of shapes and sizes of the metallic members to be bonded in the case of performing the electric current bonding of the metallic materials to each other.

The apparatus is equipped with a plurality of the metallic members 101, 102 which can be energized, a pressurizing device which makes a pressurizing force act on the plurality of the metallic members to press the metallic members to each other, electrodes 11, 12 which are installed in the plurality of the metallic members and make pairs of a plurality of sets for heating the metallic members by resistance heat generation, a power source device 6 which supplies a current to the plurality of the sets of the electrodes, and an energization controller 5 which performs energization by switching the sets of the electrodes to energize the plurality of the electrodes from the power source device.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
TSUKAMOTO TAKESHI
KASUYA TADASHI
Application Number:
JP2006085524A
Publication Date:
October 11, 2007
Filing Date:
March 27, 2006
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23K11/11; B23K20/00
Domestic Patent References:
JPH0489115A1992-03-23
JPH054877A1993-01-14
JP2002059270A2002-02-26
JP2002035955A2002-02-05
JP2005230823A2005-09-02
JPH044587A1992-01-09
Attorney, Agent or Firm:
Polaire Patent Business Corporation