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Title:
ELECTRIC WIRE MOUNTING DEVICE IN ELECTRIC WIRE TREATMENT MACHINE AND ELECTRIC WIRE MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2008066214
Kind Code:
A
Abstract:

To provide an electric wire mounting device in an electric wire treatment machine effectively preventing plugging at wire mounting and enabling an easier mounting of wires in a short time.

The electric wire mounting device includes a wire holding mechanism 14 equipped with a front clamp 2 and wire holding means 49, 50, a treatment wire feeding and ejecting mechanism 11 feeding and ejecting wires 10, and an exchange wire feeding mechanism 87. The front clamp 2 includes an exchange wire feeding groove 59 open upward crossing a wire feeding direction. By a moving operation of the exchange wire feeding mechanism 87 to an exchange wire feeding position with a holding release posture of the front clamp 2 and a holding release posture of the wire holding means 49, 50, wires for exchange 10 can be delivered astride the front clamp 2 and the pair of wire holding means 49, 50 through a gap between the exchange wire feeding groove of the front clamp 2 and the pair of exchange wire holding means 49, 50 mutually separated.


Inventors:
SATO NOBUO
YAMAZAWA HITOSHI
SHIMADA MINORU
KOKURYO HIROAKI
Application Number:
JP2006245134A
Publication Date:
March 21, 2008
Filing Date:
September 11, 2006
Export Citation:
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Assignee:
SHIN MEIWA IND CO LTD
FURUKAWA AUTOMOTIVE SYS INC
International Classes:
H01B13/00; B65H51/14
Domestic Patent References:
JP2004273194A2004-09-30
JP2001210154A2001-08-03
JP2002008462A2002-01-11
Attorney, Agent or Firm:
Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita