To provide an electrical component which retains an identical function, while intending to miniaturize it.

A connector 5, which is an electrical component has such a structure that a lead 6 is made to project to the rear surface side of a printed board 1, and this projected lead 6 is fixed to the printed board 1 by a solder 7 formed on the rear surface side. In a semiconductor device 2, a recess 8 is formed on a side opposite to the side to which a heat sink 4 is mounted, and the lead 6 of the connector 5 projected to the rear surface side of the printed board 1 is inserted into the recess 8 for layout. It is not necessary that a space L1, corresponding to a projection length of the lead 6 of the connector 5, be provided between the printed board 1 and the semiconductor element 2, unlike the prior art. For this reason, a clearance L2 between the printed board 1 and the heat sink 4 can be reduced, and the electrical component can be miniaturized and thinning becomes possible.