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Title:
ELECTRICAL INSULATION BOARD
Document Type and Number:
Japanese Patent JP2003031910
Kind Code:
A
Abstract:

To provide an electrical insulation board having a low coefficient of thermal expansion and a superior high-frequency characteristic.

This electrical insulation board is constituted by thermocompression molding a mixture, composed of one kind of molecule selected from among AlN, Al2O3 and Si3N4, and a liquid crystalline resin at a temperature of 240-320°C. The contents of the molecule and resin are respectively adjusted to 5-80% and 95-20%.


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Inventors:
TSUKUDA TAKAHIRO
MIDORIKAWA MASATOSHI
HYODO KENJI
Application Number:
JP2001220014A
Publication Date:
January 31, 2003
Filing Date:
July 19, 2001
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
C08K3/22; C08K3/28; C08K3/34; C08L67/00; C08L77/10; C08L101/00; H05K1/03; (IPC1-7): H05K1/03; C08K3/22; C08K3/28; C08K3/34; C08L67/00; C08L77/10; C08L101/00



 
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