Title:
ELECTRICALLY CONDUCTIVE ANISOTROPIC ADHESIVE
Document Type and Number:
Japanese Patent JPS61276873
Kind Code:
A
Abstract:
PURPOSE: The titled adhesive, obtained by dispersing electrically conductive particles uniformly in an insulating adhesive consisting essentially of a resin having a softening temperature of a specific temperature or above and suitable for using in connecting semiconductor integrated circuit chips to lead frames, etc.
CONSTITUTION: An adhesive obtained by uniformly dispersing electrically conductive particles, e.g. solder particles, Ni, Cu, Ag or carbon, in an insulating adhesive consisting essentially of a resin having ≤150°C softening temperature, e.g. polyacrylate based resin or polyamide-imide based resin.
Inventors:
HANADA TSUNEO
SUZUKI JUNJI
NAKAMURA MASAYUKI
MIYAZAKI TOMOZO
SUZUKI JUNJI
NAKAMURA MASAYUKI
MIYAZAKI TOMOZO
Application Number:
JP11826885A
Publication Date:
December 06, 1986
Filing Date:
May 31, 1985
Export Citation:
Assignee:
SONY CHEMICALS
International Classes:
H01B1/20; C09J11/04; H05K3/32; H05K3/36; (IPC1-7): C09J3/00; H05K3/32; H05K3/36
Domestic Patent References:
| JPS5726698A | 1982-02-12 | |||
| JPS4921440A | 1974-02-25 |
Attorney, Agent or Firm:
Sada Ito