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Patent Searching and Data


Title:
ELECTRICALLY-CONDUCTIVE FIBER-CONTAINING MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH1058446
Kind Code:
A
Abstract:

To obtain an electrically-conductive fiber-contg. molding material which simultaneously satisfies dispersibility of the electrically-conductive fibers and uniformity of pellets and exhibits a high shielding effect of electromagnetic wave with small amt. of fiber filling and excellent mechanical properties by performing cutting while a thermoplastic resin being melted and applied on the peripheries of fiber bundles of the electrically-conductive fibers has plasticity.

Fiber bundles 3 of electrically-conductive fibers are fed from the back part of a die 1 of an extruder and while they are coated with a thermoplastic resin 4 of polymethyl methacrylate resin, polyether imide resin, etc., or a blend thereof, the mixture is extrusion-molded and while this has plasticity before being cooled, it is cut by means of a pelletizer consisting of a rotating blade 5a and a fixed blade 5b. It is possible thereby to obtain an electrically- conductive fiber-contg. molding material which simultaneously satisfies dispersibility of the electrically-conductive fibers and uniformity of pellets and provides an electromagnetic wave shielding material with a high shielding effect of electromagnetic wave and excellent mechanical properties.


Inventors:
ARAKI SHINICHI
NAKAZAWA KEIICHI
Application Number:
JP22145396A
Publication Date:
March 03, 1998
Filing Date:
August 22, 1996
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B29B15/12; B29B9/06; B29K105/08; (IPC1-7): B29B9/06; B29B15/12
Attorney, Agent or Firm:
Hidetake Komatsu (3 outside)