Title:
ELECTRICALLY-CONDUCTIVE PARTICULATE AND SUBSTRATE
Document Type and Number:
Japanese Patent JP2004149923
Kind Code:
A
Abstract:
To provide an electrically-conductive particulate which is capable of bonding well an electric-pole substrate with such an element as a semiconductor chip or electric-pole substrates each other by means of such an electrically-conductive connection method as a ball grip array or a flip chip and which is excellent in the elasticity, and to provide a substrate having the electrically-conductive connection by using it and having none of the connection failure caused by a thermal cycling.
The electrically-conductive particulate has a metallic plating layer with the solder-wettability on the surface of the particulate of the base material made of a resin.
Inventors:
KAMIYOSHI KAZUHIKO
KODERA YOSHIAKI
UKAI KAZUO
KODERA YOSHIAKI
UKAI KAZUO
Application Number:
JP2003363563A
Publication Date:
May 27, 2004
Filing Date:
October 23, 2003
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B22F1/02; C25D5/56; C25D7/00; H01B5/00; (IPC1-7): C25D7/00; B22F1/02; C25D5/56; H01B5/00
Domestic Patent References:
| JPH02180036A | 1990-07-12 | |||
| JPH07157720A | 1995-06-20 | |||
| JPH0536306A | 1993-02-12 | |||
| JPH0562981A | 1993-03-12 | |||
| JPS62266842A | 1987-11-19 | |||
| JPS63231889A | 1988-09-27 |
Attorney, Agent or Firm:
Yasuo Yasutomi
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