Title:
電子デバイスに使用される電気的安定性を有する導体および抵抗体
Document Type and Number:
Japanese Patent JP4184671
Kind Code:
B2
Abstract:
An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.
Inventors:
Qi-Ming Cheng
Gerald Fredrickson
Ye Xiao
Quinn K. Tong
Daokan
Gerald Fredrickson
Ye Xiao
Quinn K. Tong
Daokan
Application Number:
JP2002032530A
Publication Date:
November 19, 2008
Filing Date:
February 08, 2002
Export Citation:
Assignee:
National Starch and Chemical Investment Holding Corporation
International Classes:
C08L101/00; C08K3/00; C08K3/04; C08K3/08; C08K3/22; C08K3/24; C08K3/28; C08K3/34; C08K3/36; C08K5/05; C08K5/06; C08K5/13; C08K5/1515; C08K5/1525; C08K5/17; C08K5/18; C08K5/24; C08K5/25; C08K5/30; C08K5/315; C08K5/32; C08K5/3432; C08K5/3437; C08K5/3445; C08K5/3475; C08K5/357; C08K5/36; C08K5/37; C08K5/375; C08K5/405; C08K5/46; C08K5/47; C08K5/5398; C08K7/06; C08K13/02; C08L63/00; C08L101/02; C08L101/06; C09J9/02; C09J11/04; H01B1/12; H01B1/20; H01B1/22; H01B1/24; H01L21/52; H01L23/498; H05K1/09; H05K3/32
Domestic Patent References:
| JP7026191A | ||||
| JP2000273317A |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Akemi Hino
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Akemi Hino
Masaya Nishiyama
Higuchi Souji