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Title:
ELECTRO-OPTIC DEVICE SUBSTRATE, METHOD OF MANUFACTURING ELECTRO-OPTIC DEVICE SUBSTRATE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2014163952
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electro-optic device substrate which allows efficient manufacturing of an element substrate and can be protected from static electricity in a manufacturing process, a method of manufacturing the electro-optic device substrate, and an electro-optic device and an electronic apparatus to which the electro-optic device substrate and the method are applied.SOLUTION: In an electro-optic device substrate, connection wires 910 and 920 as first connection wiring for mutually electrically connecting input terminals 103i of the same specification of an inspection circuit in adjacent chips C11, C12, C21, and C22 as element substrates adjacent in a first direction (X direction) and a second direction (Y direction) are provided in an inspection object unit U1 including the chips C11, C12, C21, and C22, and the connection wires 910 and 920 are arranged across a virtual scribe line SLX or a virtual scribe lines SLY located between the adjacent chips C11, C12, C21, and C22.

Inventors:
SOKABE HIDENORI
YOSHII SAKAHITO
Application Number:
JP2013031788A
Publication Date:
September 08, 2014
Filing Date:
February 21, 2013
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G09F9/30; G02F1/13; G02F1/1345; G09F9/00
Attorney, Agent or Firm:
Masaaki Kamiyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe



 
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