Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2000260225
Kind Code:
A
Abstract:
To provide an electroconductive paste capable of forming a crack-free external electrode.
This electroconductive paste is composed of electroconductive powder chiefly including Ag, organic vehicle, and glass frit. When heating is made with the mean temp. rise rate between 200 and 500°C over 100°C/min and that from room temp. to 580°C over 45°C/min, the max. shrinking speed during heating to 580°C should be below 7%/min and the tensile elongation at 500°C be over 5%.
Inventors:
TAIRA SHINICHI
HAMADA KUNIHIKO
TOKUDA TAMOTSU
HAMADA KUNIHIKO
TOKUDA TAMOTSU
Application Number:
JP5844999A
Publication Date:
September 22, 2000
Filing Date:
March 05, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K3/34; C09D5/24; H01B1/22; (IPC1-7): H01B1/22; C09D5/24; H05K3/34