To obtain the subject paste useful for bonding a semiconductor element to a metal frame, excellent in workability during dispensing coating, curable at a relatively low temperature in an extremely short time, low in ionic impurities such as chlorine, sodium, etc.

This electroconductive resin paste comprises (A) 60-90wt.% of silver powder, (B) 1-20wt.% of an epoxyacrylic resin of formula I, (C) 0.5-8wt.% of a silicone compound containing two vinyl groups or (meth)acrylic groups in one molecule of formula II and (D) 0.05-4wt.% of an organic peroxide of formula III as essential components. The component B is obtained by reacting a phenolic compound of formula III with glycidyl methacrylate. The decomposition temperature to make the half life of the component D 10 hours is preferably ≥90°C.