Title:
ELECTRODE TREATING STRUCTURE OF BUTTERFLY TYPE SEMICONDUCTOR MODULE AND ELECTRODE TREATING METHOD
Document Type and Number:
Japanese Patent JPH10242615
Kind Code:
A
Abstract:
To prevent a decrease in reliability of a butterfly type semiconductor module by extremely simply performing an electric connection of an electrode pin to an externally drawing lead by soldering without difficulty.
The electrode treating structure comprises a connecting auxiliary board 2 having a first land 21 for connecting an electrode pin and a second land 22 for connecting an externally drawing lead 31 in the state in contact with a lower surface of an electrode pin 16 of the butterfly type semiconductor module 1. In this case, the pin 16 is electrically connected to the land 21 by soldering and the lead 31 is electrically connected to the land 22 by soldering.
Inventors:
OKUYAMA TAKASHI
HASHIMOTO MAMORU
YOSHIDA MINORU
TAHIRA MASATOSHI
SUDO TAKAHIDE
HASHIMOTO MAMORU
YOSHIDA MINORU
TAHIRA MASATOSHI
SUDO TAKAHIDE
Application Number:
JP4822097A
Publication Date:
September 11, 1998
Filing Date:
March 03, 1997
Export Citation:
Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
H05K1/18; H05K1/14; H05K3/34; H05K3/36; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Tsugawa friend