Title:
ELECTRODEPOSITION PROCESS USED IN PRODUCTION OF SEPARATE LETTER BY ELECTROFORMING
Document Type and Number:
Japanese Patent JPH05320974
Kind Code:
A
Abstract:
PURPOSE:To obtain an electrodeposit having no hooking edges by applying an insulator on a substrate and successively electrodepositing, peeling and electrodepositing the insulator. CONSTITUTION:An insulator 1 such as a photoresist is deposited on a substrate 2, and electrodeposition is applied to obtain an electrodeposit 3. The surface of the electrodeposit 3 is then peeled off, and secondary electrodeposition is applied thereon to obtain a secondary electrodeposit 5. The electrodeposit 5 is then peeled off, and an electrodeposit having no hooking edges on the side face and which is not peeled off even when touched with the hand is obtained by electroforming.
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Inventors:
WATANABE EIJI
Application Number:
JP15601692A
Publication Date:
December 07, 1993
Filing Date:
May 22, 1992
Export Citation:
Assignee:
ODENSHA KK
International Classes:
B41B5/00; C25D1/00; (IPC1-7): C25D1/00; B41B5/00
Attorney, Agent or Firm:
Yokomizo Narumi