Title:
基板をコーティングするための電着可能な誘電性コーティング組成物および誘電性コーティングを形成する方法
Document Type and Number:
Japanese Patent JP2005530909
Kind Code:
A
Abstract:
The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of the resin (a). The resinous phase has a covalently bonded halogen content based on total weight of resin solids present in the resinous phase such that when the composition is electrodeposited and cured, the cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50. The invention also is directed to a method for forming a dielectric coating on an electroconductive substrate using the electrodepositable coating composition, as well as to a substrate coated with the electrodepositable composition.
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Inventors:
McCallum, Gregory Jay.
Morality, Thomas Sea.
Olson, Kevin Shee.
Sandara, Michael G.
One, Alan Yi.
Wilson, Craig A.
The Wacky, Stephen Earl.
Morality, Thomas Sea.
Olson, Kevin Shee.
Sandara, Michael G.
One, Alan Yi.
Wilson, Craig A.
The Wacky, Stephen Earl.
Application Number:
JP2004517990A
Publication Date:
October 13, 2005
Filing Date:
June 27, 2003
Export Citation:
Assignee:
Ppee Industries Industries Ohio, Inc.
International Classes:
C09D5/18; C09D5/25; C09D5/44; C09D123/28; C09D133/00; C09D157/08; C09D161/20; C09D163/00; C09D175/04; H01L21/48; H01L23/14; C09D201/02; H05K1/05; H05K3/28; H05K3/44; H05K3/00; H05K3/38; H05K3/42; H05K3/46; (IPC1-7): C09D201/02; C09D5/18; C09D5/25; C09D5/44; C09D123/28; C09D133/00; C09D157/08; C09D161/20; C09D163/00; C09D175/04; H05K3/28
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita