To provide an electroforming nameplate which eliminates the need for secondary work, is greatly improved in productivity and does not impair the parts necessary for adhesion of character parts in the secondary work by using UV pressure sensitive adhesives in place of the conventional pressure sensitive adhesives as adhesives to an adherend, previously irradiating the adhesives with UV light and pressure bonding the nameplate to the adherend, then peeling the transparent adhesive film on the surface and simultaneously adhering the adhesive in the parts exposed with the UV light to the transparent adhesive film side and removing the same.

The UV pressure sensitive adhesives 2 are applied on the rear surface side of nickel plating 4 adhered at the front surface to the transparent adhesive film 1 and further release paper 3 is adhered thereon. The adhesives 2 between and around the character parts 4 are cured by irradiation with the UV light 5 from above the transparent adhesive film 1. The adhesion of the nameplate to the adherend is executed by peeling the release paper 3 and press bonding the nameplate to the adherend, then peeling the transparent adhesive film 1. The cured adhesives 2 are adhered onto the transparent adhesive film 1 and the excess adhesives 2 between and around the characters adhered to the adherend are removed.