Title:
ELECTROLESS PLATING METHOD
Document Type and Number:
Japanese Patent JPS62207874
Kind Code:
A
Abstract:
PURPOSE: To increase the strength of a plated product and to improve the corrosion resistance by aluminizing a base material to be plated before electroless plating so as to fill the pinholes in the base material.
CONSTITUTION: A base material to be plated is sipped in an aluminizing bath to coat the surface of the base material having pinholes with molten Al. A continuous Al film is formed on the base material by the coating and electroless plating is carried out on the film. Since the pinholes in the base material are filled with molten Al to produce an anchoring effect, the strength of a plated product is increased and the corrosion resistance is improved.
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Inventors:
NAGATANI KAZUYOSHI
Application Number:
JP5126186A
Publication Date:
September 12, 1987
Filing Date:
March 08, 1986
Export Citation:
Assignee:
WAKAMATSU NETSUREN KK
International Classes:
C23C18/16; C23C18/18; C23C18/34; C23C28/02; (IPC1-7): C23C18/16; C23C28/02