To provide an electroless plating solution exhibiting a good plating metal-filling performance even for large trenches or via holes of several m to one hundred tens m in such a manner as to be free from voids or seams and allowing maintenance of stabilized performance over long period of time.
The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt and a complexing agent. In addition, the solution contains, as a leveler, a sulfur-based organic compound having at least one alicyclic or aromatic ring group, or the cyclic group to which at least one optional substituent is bonded. The alicyclic or aromatic ring group contains optional numbers of carbon, oxygen, phosphorus, sulfur and nitrogen atoms.
ISHIZAKI TAKAHIRO
KAWASE TOSHIHIRO
TAKEUCHI MASAHARU
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Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi
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