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Title:
ELECTROLESS PLATING SOLUTION, ELECTROLESS PLATING METHOD USING THE SAME, AND METHOD FOR PRODUCTION OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2010031361
Kind Code:
A
Abstract:

To provide an electroless plating solution exhibiting a good plating metal-filling performance even for large trenches or via holes of several m to one hundred tens m in such a manner as to be free from voids or seams and allowing maintenance of stabilized performance over long period of time.

The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt and a complexing agent. In addition, the solution contains, as a leveler, a sulfur-based organic compound having at least one alicyclic or aromatic ring group, or the cyclic group to which at least one optional substituent is bonded. The alicyclic or aromatic ring group contains optional numbers of carbon, oxygen, phosphorus, sulfur and nitrogen atoms.


Inventors:
HOTTA TERUYUKI
ISHIZAKI TAKAHIRO
KAWASE TOSHIHIRO
TAKEUCHI MASAHARU
Application Number:
JP2009137130A
Publication Date:
February 12, 2010
Filing Date:
June 08, 2009
Export Citation:
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Assignee:
UYEMURA C & CO LTD
International Classes:
C23C18/40; C23C18/36; H05K3/18; H05K3/40; H05K3/42
Domestic Patent References:
JP2000265280A2000-09-26
JPH11269658A1999-10-05
JPH031382B21991-01-10
JP2004010964A2004-01-15
JP2006104500A2006-04-20
JP2000034593A2000-02-02
JP2001073182A2001-03-21
JP2007146285A2007-06-14
JPS6324072A1988-02-01
Attorney, Agent or Firm:
Akira Koike
Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi