PURPOSE: To easily form a plating film on the surface of copper without requiring special treatment by using methanesulfonic acid, 1-hydroxyethane-1,1-sec. phosphoric ester, an Sn compd., a Pb compd. and a reducing agent as essential components.
CONSTITUTION: An electroless solder plating bath compsn. is prepd. by using about 130-240g/l methanesulfonic acid, about 4-20g/l 1-hydroxyethane-1,1-sec. phosphoric ester or salt thereof, about 18-36g/l (expressed in terms of Sn) Sn compd., about 15-35g/l (expressed in terms of Pb) Pb compd. and about 44-140g/l reducing agent as essential components. In the compsn., Sn and Pb are present as methanesulfonates or phosphonates. This compsn. can be utilized to prevent the corrosion of electronic parts, prints, etc., and to carry out soldering.
FUKUOKA KATSUHIRO
KIYOHARA KEIKI
YONEKURA SABURO
MIYATAKE ISAO
| JPH01184279A | 1989-07-21 | |||
| JPH01290774A | 1989-11-22 |