Title:
電解コンデンサ及び電解コンデンサの実装構造
Document Type and Number:
Japanese Patent JP7259407
Kind Code:
B2
Abstract:
To provide an electrolytic capacitor of a structure less in the quantity of a molten solder beyond an intended range in mounting and arranged so that a large fillet is never formed in mounting.SOLUTION: An electrolytic capacitor 1 comprises: a laminate including a capacitor element; an encapsulating resin mold 9 serving to encapsulate the periphery thereof; a first external electrode 11 formed on a first end face 9a thereof and electrically connected to a positive electrode; a second external electrode 13 formed on a second end face 9b and electrically connected to a negative electrode; a third external electrode 15 formed on a first end face side of a bottom face; and a fourth external electrode 17 formed on a second end face side of the bottom face. The first to fourth external electrodes both each have a base electrode layer and a plating layer formed thereon. The base electrode layer of the first external electrode is away from that of the third external electrode, and the base electrode layer of the second external electrode is away from that of the fourth external electrode.SELECTED DRAWING: Figure 2
Inventors:
Yasuhiro Tamaya
Kazuya Kusuda
Takeshi Furukawa
Kazuya Kusuda
Takeshi Furukawa
Application Number:
JP2019035920A
Publication Date:
April 18, 2023
Filing Date:
February 28, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G9/012; H01G4/30; H01G9/048
Domestic Patent References:
| JP2004063543A | ||||
| JP2015162648A | ||||
| JP58027933U |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus