Title:
ELECTROLYTIC DRESSING METHOD BY SEMICONDUCTOR CONTACT ELECTRODE AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3169631
Kind Code:
B2
Abstract:
PURPOSE: To provide an electrolytic dressing method and an device therefor, wherein the dc power source is applicable by forming an insulating coating thin and uniform.
CONSTITUTION: In an electrolytic dressing method for dressing a grinding wheel by electrolysis by allowing conductive fluid to flow between a conductive grinding wheel 10 provided with a contact surface 12 to a work piece 16 and an electrode 20 faced the contact surface, and applying voltage between the grinding wheel and the electrode, the electrode 20 composed of semiconductor material is brought in contact with the contact surface 12 of the grinding wheel 10.
Inventors:
Tadashi Ohmori
Takeo Nakagawa
Takeo Nakagawa
Application Number:
JP12728991A
Publication Date:
May 28, 2001
Filing Date:
May 30, 1991
Export Citation:
Assignee:
RIKEN
International Classes:
B23H5/00; B23H5/06; B23H5/10; B24B53/00; (IPC1-7): B24B53/00
Domestic Patent References:
| JP61146467A | ||||
| JP614665A |
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)