Title:
ELECTROLYTIC POLISHING LIQUID FOR NOBLE METAL OR ALLOY THEREOF
Document Type and Number:
Japanese Patent JPS5739200
Kind Code:
A
Abstract:
PURPOSE:To provide the titled electrolytic polishing liquid improving polishing property, surface smoothness as well as enhancing mirror surface gloss in subjecting a noble metal or an alloy thereof to electrolytic polishing being prepared by increasing a ratio of hydrochloric acid and phosphoric acid against water respectively. CONSTITUTION:Said electrolytic polishing liquid is prepared by compounding hydrochloric acid, phosphoric acid and water in a volume ratio of 0.5-5:0.5-3: 0.5-2. As an electrolytic polishing method using said electrolytic polishing liquid, a method applying either D.C. or commutating voltage may be employed. Further, in subjecting a noble metal such as gold, silver, platinum, Pd or the like or an alloy thereof to electrolytic polishing by using said electrolytic polishing liquid, other than aforementioned characteristics, a time required in electrolysis is shorten compared to a conventional one. Further, said electrolyte displays especially excellent effect in the tip processing of an acupuncture needle or a stylus for current conductive detection.
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Inventors:
HAYASHI SHIYOUZOU
Application Number:
JP11510380A
Publication Date:
March 04, 1982
Filing Date:
August 20, 1980
Export Citation:
Assignee:
TANAKA ELECTRONICS IND
International Classes:
C25F3/22; C25F3/16; (IPC1-7): C25F3/16