Title:
ELECTROLYTIC SURFACE PROCESSING APPARATUS FOR LEAD FRAME FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPH07335810
Kind Code:
A
Abstract:
PURPOSE: To shorten processing time and reduce uneven processing by making uniform in the width direction of a lead frame current density among a lead frame and both electrode plates 12, 13 disposed on opposite sides of the lead frame when the surface of the lead frame A is surface processed with electrolysis.
CONSTITUTION: A surface between those of both electrode plates 12, 13 facing a lead frame A is formed into middle height surfaces 12c, 13c which is high in the vicinity of the center of the lead frame in the width direction and is inclined progressively lower toward left and right longitudinal side edges A', A" of the lead frame in the width direction.
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Inventors:
WADA KENJI
Application Number:
JP12880194A
Publication Date:
December 22, 1995
Filing Date:
June 10, 1994
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
C25D17/12; C25D7/00; C25D7/12; H01L21/56; H01L23/50; (IPC1-7): H01L23/50; C25D7/12; C25D17/12; H01L21/56
Attorney, Agent or Firm:
Akio Ishii (2 outside)