To improve the inhibitory effect of unnecessary emission and surface transmission without increasing the size of an electromagnetic band gap structure.

After a ground layer 4 is formed on one surface 3a of a first substrate 3 and a seed layer 27 is formed on one surface 10a of a second substrate 10, a first resist 28 is patterned and a conductor layer 22 is grown in an opening 29 of the first resist 28 by performing electrolytic plating. After the first resist 28 is removed, a thick second resist 30 is patterned and a columnar conductor 24 is grown in an opening 31 of the second resist 30 by performing the electrolytic plating. After the second resist 30 is removed, the seed layer 27 is patterned by etching and a dielectric layer 17 is formed on the one surface 10a of the second substrate 10. An upper surface of the columnar conductor 24 is exposed by grinding a surface of the dielectric layer 17 and the upper surface of the columnar conductor 24 is joined to the ground layer 4 by a solder bump 5.