Title:
ELECTROMAGNETIC SHIELDING OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH05327270
Kind Code:
A
Abstract:
PURPOSE: To provide a method for electromagnetic shielding of a circuit board by which the diffusion of an electromagnetic noise from the circuit board can be prevented more effectively.
CONSTITUTION: A circuit board A' is so structured that the entire board including electronic components P1-P4 is coated with thermosoftening electromagnetic shielding material S which is cut to the same shape as the circuit board A' and the shielding material S is heated and then cooled to be stuck tightly to the board. By such a structure, the diffusion of an electromagnetic noise from the circuit board A' can be prevented effectively.
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Inventors:
SENOO SEIICHI
Application Number:
JP13081292A
Publication Date:
December 10, 1993
Filing Date:
May 22, 1992
Export Citation:
Assignee:
SHARP KK
International Classes:
H05K9/00; H05K1/02; H05K3/28; (IPC1-7): H05K9/00
Attorney, Agent or Firm:
Takeo Honjo