Title:
電磁波シールドシート、および電磁波シールド性配線回路基板
Document Type and Number:
Japanese Patent JP7400406
Kind Code:
B2
Abstract:
To provide an electromagnetic wave shield sheet having solder reflow resistance, excellent high-temperature and high-humidity stability, high punching processability, excellent high-frequency shielding properties, and transmission characteristics suitable for high-frequency signals and to provide a wiring circuit board using the same.SOLUTION: The electromagnetic wave shield sheet has a laminated body with a conductive adhesive layer, a metal layer, and a protective layer in this order. The conductive adhesive layer contains a binder resin, a conductive filler, and reinforcing particles. The reinforcing particles have a DBP oil absorption of 15 to 400 ml/100 g as specified in JIS K 6217-4.SELECTED DRAWING: Figure 1
Inventors:
Shota Mori
Shiori Kumagai
General Kishi
Shiori Kumagai
General Kishi
Application Number:
JP2019215554A
Publication Date:
December 19, 2023
Filing Date:
November 28, 2019
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
International Classes:
H05K9/00; B32B7/025; B32B27/20; H05K1/02
Domestic Patent References:
| JP6597927B2 | ||||
| JP2019176143A | ||||
| JP2017135248A | ||||
| JP6504302B2 | ||||
| JP2018061011A |
Previous Patent: Image forming device
Next Patent: Communication terminal, photographing system, image processing method and program
Next Patent: Communication terminal, photographing system, image processing method and program