Title:
電磁波シールドシート、並びにプリント配線板およびその製造方法
Document Type and Number:
Japanese Patent JP7452230
Kind Code:
B2
Abstract:
To provide an electromagnetic wave shield sheet superior in solder reflow resistance, having an excellent transmission property in an RF region, and superior in reworkability, and a printed wiring board and a production method thereof.SOLUTION: An electromagnetic wave shield sheet 10 comprises a laminate having a protection layer 3, a metal layer 2, and an adhesive layer 1 in this order. The adhesive layer 1 has a plurality of communicating gap parts 4 arranged to extend to at least one side face. A printed wiring board 20 comprises: a wiring board 25 with a signal line 23 formed on an insulative base material 22; a cover coat layer 26 formed on a wiring board 25 and having an insulating property; and the electromagnetic wave shield sheet 10.SELECTED DRAWING: Figure 1
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Inventors:
Shota Mori
Hidenobu Kobayashi
Mitsuharu Hino
Shiori Kumagai
General Kishi
Hidenobu Kobayashi
Mitsuharu Hino
Shiori Kumagai
General Kishi
Application Number:
JP2020079933A
Publication Date:
March 19, 2024
Filing Date:
April 30, 2020
Export Citation:
Assignee:
artience Co., Ltd.
International Classes:
H05K9/00; B32B7/025; B32B7/12; H01P3/04; H01P11/00; H05K1/02
Domestic Patent References:
| JP50048870U | ||||
| JP2004095566A | ||||
| JP2019024117A | ||||
| JP10292155A | ||||
| JP2006117747A | ||||
| JP7299842A | ||||
| JP2005166693A | ||||
| JP3006438U |
Attorney, Agent or Firm:
Ken Ieiri
Keiko Hata
Keiko Hata