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Title:
ELECTROMAGNETIC SHIELDING STRUCTURE OF ELECTRONIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3892189
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To solve the problems that for a printed board 103 having a plurality of regions thereon where a plurality of electronic components to be shielded against electromagnetic waves exist, the same number of identical shield structures composed of eases 101, front covers 102, back covers 104, etc., must be prepared as the number of the regions and much labor is taken for manufacturing because of the increased number of components.
SOLUTION: The electromagnetic shield structure comprises an electronic circuit board having regions having mounted electronic components to be shielded against electromagnetic waves and a ground pattern formed around the regions, frames connected to the ground pattern so as to surround the regions having the mounted electronic components to be shielded against electromagnetic waves, a shield cover covering the frames so as to shield the electric components to be shielded against electromagnetic waves from outside, and partitions provided in the shield cover for individually shielding the frames.


Inventors:
Chiharu Miyazaki
Naoto Oka
Mitsuhiko Kanda
Yuma Uchida
Koichi Hirao
Application Number:
JP34247599A
Publication Date:
March 14, 2007
Filing Date:
December 01, 1999
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K9/00; (IPC1-7): H05K9/00
Domestic Patent References:
JP7147495A
JP8102593A
JP10270889A
JP7212069A
JP6232585A
JP5206679A
JP11307978A
JP9231336A
JP4121796U
Attorney, Agent or Firm:
Hiroaki Tazawa
Konobu Kato