Title:
ELECTROMAGNETIC WAVE ABSORBING MATERIAL AND ELECTROMAGNETIC WAVE ABSORBING RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2021057545
Kind Code:
A
Abstract:
To provide an inexpensive electromagnetic wave absorbing material capable of efficiently absorbing an electromagnetic wave containing a high-frequency band of 45 to 100 GHz and a lightweight and high-strength electromagnetic wave absorbing resin molded body containing the same.SOLUTION: The electromagnetic wave absorbing material is coated with a carbon nanostructure having a graphene structure on a surface of carbon material. The carbon nanostructure does not contain any metal elements. The carbon nanostructure is preferably a carbon nanotube and/or a carbon nanowall.SELECTED DRAWING: None
Inventors:
FURUBAYASHI HIROYUKI
MORI MASAKAZU
IKEDA SUNAO
KARINO SHUN
MORI MASAKAZU
IKEDA SUNAO
KARINO SHUN
Application Number:
JP2019182052A
Publication Date:
April 08, 2021
Filing Date:
October 02, 2019
Export Citation:
Assignee:
SANKEI GIKEN KOGYO CO LTD
UNIV RYUKOKU
UNIV OKAYAMA
UNIV RYUKOKU
UNIV OKAYAMA
International Classes:
H05K9/00; B60R13/04; B60R19/03; C01B32/05; C01B32/158; C01B32/16; C01B32/18; D06M10/00; D06M11/74
Domestic Patent References:
| JP2015144294A | 2015-08-06 | |||
| JP2019099989A | 2019-06-24 | |||
| JP2019161208A | 2019-09-19 |
Foreign References:
| WO2012144150A1 | 2012-10-26 |
Attorney, Agent or Firm:
Patent business corporation ipr consultant