Title:
ELECTROMAGNETIC WAVE SHIELD COVER, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015057829
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield cover capable of electromagnetically shielding various terminals and various electronic components.SOLUTION: An electromagnetic wave shield cover can be manufactured by immersing a molding die in soft resin sol to apply and dry the soft resin sol and then in an electrically conductive resin solution to apply and dry the conductive resin solution. The electromagnetic wave shield cover has an electrically conductive resin layer laminated outside an inner layer formed of a soft resin layer. A soft resin layer may be further laminated outside the electrically conductive resin layer. The electrically conductive resin is preferably poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate) composite. A method of manufacturing the electromagnetic wave shield cover of the present invention includes simple processes, and the obtained electromagnetic wave shield cover has superior adhesive strength between the soft resin layer and the electrically conductive resin layer. The electromagnetic wave shield cover is soft on the whole and thereby easily covers terminals and components and has superior adhesiveness, so that electromagnetic shielding properties are superior.
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Inventors:
QI WUBO
INAMURA MICHIO
INAMURA MICHIO
Application Number:
JP2014192266A
Publication Date:
March 26, 2015
Filing Date:
September 22, 2014
Export Citation:
Assignee:
NISSEI ECO CO LTD
International Classes:
H05K9/00; B32B27/00; B32B27/30; C08G61/12; C08L25/18; C08L27/06; C08L83/04
Domestic Patent References:
| JP2006291032A | 2006-10-26 | |||
| JP2005313342A | 2005-11-10 | |||
| JPH0660197U | 1994-08-19 | |||
| JPH11167825A | 1999-06-22 | |||
| JP2009302432A | 2009-12-24 | |||
| JP2009178897A | 2009-08-13 | |||
| JPS61166098A | 1986-07-26 |
Attorney, Agent or Firm:
Kozo Sasa