Title:
ELECTROMAGNETIC WAVE SHIELD FILM, MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD WITH ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
Japanese Patent JP2021177505
Kind Code:
A
Abstract:
To provide an electromagnetic wave shield film which can improve the transmission characteristics of an FPC and satisfy all of the reduction in the thickness of the electromagnetic wave shield film, the improvement of the adhesion, the peeling prevention and the excellent heat resistance.SOLUTION: An electromagnetic wave shield film includes an insulation resin layer, an electromagnetic wave shielding layer and an adhesive layer that are laminated in this order. The electromagnetic wave shielding layer is a metal layer which has thickness between 1 μm and 5 μm and includes copper. Arithmetic mean roughness (Ra) of a surface on the adhesive layer side of the electromagnetic wave shielding layer is between 0.01 μm and 0.25 μm. The adhesive layer includes resin. Weight average molecular weight (Mw) of the resin is between 50,000 and 400,000. An acid value of the resin is between 2 mgKOH/g and 50 mgKOH/g.SELECTED DRAWING: None
Inventors:
KATAGIRI WATARU
MOMMA SHIORI
MOMMA SHIORI
Application Number:
JP2020081872A
Publication Date:
November 11, 2021
Filing Date:
May 07, 2020
Export Citation:
Assignee:
SHINETSU POLYMER CO
International Classes:
B32B7/025; H05K9/00; B32B7/12; B32B15/08; C09J7/30; C09J201/00; H05K1/02
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Sachiko Komori
Takeshi Yamashita
Yoshihiro Higuchi
Nao Oda
Sachiko Komori
Takeshi Yamashita
Yoshihiro Higuchi
Previous Patent: Conveyor and processing equipment
Next Patent: Micro LED chip transport film and micro LED chip transport method
Next Patent: Micro LED chip transport film and micro LED chip transport method