Title:
電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板及びその製造方法
Document Type and Number:
Japanese Patent JP6924592
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting composition that can form an insulation resin layer and an adhesive layer with improved adhesion to a metal thin film layer and a cured product thereof, an electromagnetic wave shield film having a layer containing the thermosetting composition or the cured product, a printed wiring board with an electromagnetic wave shield film, and a method of producing the same.SOLUTION: An electromagnetic wave shield film 1 has an insulation resin layer 10, a metal thin film layer 22 adjacent to the insulation resin layer 10, and an adhesive layer 24 adjacent to the metal thin film layer 22 on the opposite side from the insulation resin layer 10. At least one of the insulation resin layer 10 and the adhesive layer 24 is a thermosetting composition or a cured product thereof, containing a specific compound.SELECTED DRAWING: Figure 1
Inventors:
So Matsubayashi
Kazuyoshi Yoshida
Katagiri
Hiromi Takezawa
Minoru Kubota
Tsutomu Saga
Kazuyoshi Yoshida
Katagiri
Hiromi Takezawa
Minoru Kubota
Tsutomu Saga
Application Number:
JP2017051828A
Publication Date:
August 25, 2021
Filing Date:
March 16, 2017
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
C08G59/62; B32B15/092; C09J9/02; C09J163/00; H05K1/02; H05K9/00
Domestic Patent References:
| JP2005272547A | ||||
| JP2015010214A |
Foreign References:
| WO2007125650A1 |
Attorney, Agent or Firm:
Nishizawa Kazumi
Yuichiro Kawagoe
Shunsuke Fushimi
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yuichiro Kawagoe
Shunsuke Fushimi
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi