Title:
ELECTROMAGNETIC WAVE SHIELD MATERIAL
Document Type and Number:
Japanese Patent JP2708708
Kind Code:
B2
Abstract:
PURPOSE: To provide a reliable electromagnetic shield material which is capable of plastic machining and achieves a sufficient electromagnetic wave shield performance even after plastic machining.
CONSTITUTION: This material consists of an electromagnetic screening layer 2a where a metal layer 4 and a conductive mesh 6 are laminated and a hot melt layer 2b formed by thermoplastic resin which melts when heated and is an electromagnetic wave shield material 2 formed in a sheet shape and the metal layer 4 is made of a low melt-point metal indicating a high plasticity when heated closer to a melt point. Therefore, even if plastic machining such as vacuum formation is performed along with a plastic plate to be formed at an enclosure, etc., the metal layer 4 does not break and is extended according to the deformation on vacuum formation.
Inventors:
Yumi hero
Kondo Shizuka
Kondo Shizuka
Application Number:
JP33814993A
Publication Date:
February 04, 1998
Filing Date:
December 28, 1993
Export Citation:
Assignee:
Kitagawa Industry Co., Ltd.
International Classes:
B32B15/02; H05K9/00; (IPC1-7): H05K9/00; B32B15/02
Domestic Patent References:
| JP6314499A | ||||
| JP268999A | ||||
| JP60177699A | ||||
| JP180332U |
Attorney, Agent or Firm:
Adachi Tsutomu
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