Title:
ELECTROMAGNETIC WAVE SHIELDING MATERIAL
Document Type and Number:
Japanese Patent JP2003209391
Kind Code:
A
Abstract:
To assure the effect of electromagnetic wave shielding while the number of processes are reduced because the direct earthing process for exhausting unwanted electromagnetic wave is difficult from the structural view point, although various members are used as a measure for shielding the electromagnetic wave.
The thread type copper foil which is entirely covered with a solder-plated flat plate is braided. Consequently, the earthing process can be adhered easily thereto while the lead wire is flexibly protected and bundled. Accordingly, the number of such processes required for exhaustion of unwanted electromagnetic wave can be reduced and the effect of electromagnetic wave shielding can surely be attained.
Inventors:
MAESAKO YOSHIYUKI
Application Number:
JP2002042336A
Publication Date:
July 25, 2003
Filing Date:
January 16, 2002
Export Citation:
Assignee:
DENKA ELECTRON KK
International Classes:
C25D7/06; D04B21/20; D04C1/12; D06M11/00; D06M11/83; H01B11/10; H05K9/00; (IPC1-7): H05K9/00; C25D7/06; D04B21/20; D04C1/12; D06M11/83; H01B11/10