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Patent Searching and Data


Title:
ELECTRONIC APPARATUS CASING AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003264377
Kind Code:
A
Abstract:

To manufacture a lightweight electronic apparatus casing with excellent cooling efficiency at a low cost.

The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in which the radiation fin previously arranged in a casing metal mold is integrally formed by injection molding, and the electronic apparatus casing is manufactured. A fitting detent 3 is provided in the region of a joining plane of a casing main body of the radiation fin 2, and when a Mg alloy is filled in the casing metal mold by thixo-molding, the fitting detent 3 is deformed under the filling pressure of the Mg alloy, to raise fitting strength between the radiation fin 2 and the Mg alloy-made casing 1.


Inventors:
KANEKO KIMIHIRO
MAEJIMA SHIGETO
Application Number:
JP2002062521A
Publication Date:
September 19, 2003
Filing Date:
March 07, 2002
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B22D19/00; B22D17/00; B22D17/22; B22D19/04; H05K5/02; (IPC1-7): H05K5/02; B22D17/00; B22D19/00; B22D19/04
Attorney, Agent or Firm:
Hiroaki Tazawa (1 person outside)