To provide a compact and highly reliable electronic apparatus, and to provide a package.

The electronic apparatus includes: a first substrate 15 where first and second recessions 11, 12 are arranged, a first electrode pad 13 is formed near the first recession 11, and a first gasket 14 for enclosing the first electrode pad 13 is formed near the second recession 12; an electronic component 22 placed on the first substrate 15; and a second substrate 18 where a second electrode pad 16 is formed to correspond to the first electrode pad 13, and a second gasket 17 for enclosing the second electrode pad 16 is formed to correspond to the first gasket 14. Eutectic bonding is performed respectively between the first and second electrode pads 13, 16, and the first and second gaskets 14, 17, so as to fix the second substrate 18 to the first substrate 15. Eutectic materials 25, 26 protruded from the eutectic bonders 23, 24 are drawn to the first and second recessions 11, 12, so as to prevent short-circuiting.