Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2015122430
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a configuration appropriate for improving heat conductivity right under a sheet member positioned right under a heat radiation surface in an electronic apparatus where the sheet member containing a heat conductive filler and a floating substance in a porous substrate is interposed between the heat radiation surface of an electronic component and a cooling member.SOLUTION: A sheet member 300 is divided into a beneath part 310 whose plane size is larger than that of a heat radiation surface 101 and which is positioned right under the heat radiation surface, and a protrusion part 320 which protrudes from the heat radiation surface 101 and is not in contact with an electronic component 100. The beneath part 310 is pressed down by the electronic component 100 so as to be thinner than the protrusion part 320 and by reducing a density of a floating substance 350 rather than that of the protrusion part 320, a density of a conductive filler 340 is improved. A gap between the beneath part 310 and an interface between the heat radiation surface 101 and a cooling member 200 is filled by the floating substance 350 exuding from a porous substrate 330.
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Inventors:
KOIKE HARUHISA
NOMURA TORU
NOMURA TAKUMI
SUZUKI TOSHIO
KOJIMA YUJI
NOMURA TORU
NOMURA TAKUMI
SUZUKI TOSHIO
KOJIMA YUJI
Application Number:
JP2013265784A
Publication Date:
July 02, 2015
Filing Date:
December 24, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/373; H01L23/36; H05K7/20
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office
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