PURPOSE: To effectively interconnect a plurality of chassises using fewer components without increasing in size an apparatus and to facilitate assembling.
CONSTITUTION: A shield film 20 having conductivity at least on one surface and a protrusion 23 formed on the conductive surface side is arranged in an apparatus body 10 in such a manner that the protrusion 23 is brought into pressure contact with one surface 11c of opposed chassises 11 and 12 of the body 10 in a pressurized state to prevent generation of a radio wave failure from printed boards 16, 17 by the film 20 and to conduct the conductive surface of the film 20 to the chassis 12 through a screw 19. Thus, a plurality of chassises can be conducted therebetween without screw-clamping the protrusion 23 side of the film 20 or without using a contactor.
JP63112395B | ||||
JP62063999B | ||||
JPH03214796A | 1991-09-19 |
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