Title:
ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP3508453
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To connect a chip part and electrode parts electrically and securely in the constitution, wherein the chip part is bonded to the electrode parts by the conducting bonding agent of a thermosetting type.
SOLUTION: Electrode parts 2a-4a are provided in a holder 1 made of resin. At the same time, a groove part 9 is formed between these electrode parts 2a-4a. Then, under the state, wherein thermosetting-type connecting epoxy resin 8 is dropped, the entire holder 1 is heated after a hip capacitor 7 is mounted. Then, the thermosetting-type epoxy resin 8 is hardened. Therefore, the parts between the electrode parts 2a-4a are connected. When the holder 1 is cooled and shrinks at this time, the sizes between the electrode parts 2a-4a shrinks, and large stress acts on the chip capacitor 7. Since the groove part 9 between the electrodes 2a-4a is embedded with thermosetting type reinforced epoxy resin 10, however, the shrinkage between the electrode parts 2a-4a accompanied by the shrinkage of the holder 1 can be blocked.
Inventors:
Sumiya, Kazuyoshi
Horiba, Keiji
Horiba, Keiji
Application Number:
JP6086697A
Publication Date:
March 22, 2004
Filing Date:
March 14, 1997
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/28; H01L21/52; H05K3/32; H05K3/30; H05K3/34; (IPC1-7): H01L23/28; H01L21/52; H05K3/32
Attorney, Agent or Firm:
佐藤 強